Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints-Reference-Cited by-同舟云学术

Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints

Published:2021-08 Issue: Volume:178 Page:111195
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Gao Li-Yin,Luo Yi-Xiu,Wan Peng,Liu Zhi-Quan

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference36 articles.

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3. Failure mechanism of the SnAgCu/SnPb mixed soldering process in a ball grid Array structure;Gao;J. Electron. Mater.,2020

4. Effect of intermetallic compounds on vibration fatigue of μBGA solder joint;Tu;IEEE Trans. Adv. Packag.,2001

5. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products;Shnawah;Microelectron. Reliab.,2012

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