Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties-Reference-Cited by-同舟云学术

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Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

Published:2024-07 Issue: Volume:31 Page:3591-3603
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Huo Fupeng,Chen Chuantong^ORCID,Zhang Zheng,Zhang Yicheng,Suetake Aiji,Takeshita Kazutaka,Yamaguchi Yoshiji,Momose Yashima,Zhang Keke,Suganuma Katsuaki

Funder

NEDO

Publisher

Elsevier BV

Reference57 articles.

1. New challenges of miniaturization of electronic devices: electromigration and thermomigration in lead-free solder joints;Zhang;Mater Des,2020

2. Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package;Zhang;J Adv Join Process,2022

3. Materials, processing and reliability of low temperature bonding in 3D chip stacking;Zhang;J Alloys Compd,2018

4. Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging;He;Adv Mater,2022

5. Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging;Xiong;J Mater Sci,2019

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