Electrical property-microstructure of copper interconnects printed by localized pulsed electrodeposition (l-PED)-Reference-Cited by-同舟云学术

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Electrical property-microstructure of copper interconnects printed by localized pulsed electrodeposition (l-PED)

Published:2023-01 Issue: Volume:330 Page:133364
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Bhuiyan Md Emran Hossain,Wang Chao,Arellano-Jimenez M. Josefina,Waliullah Mohammad,Quevedo-Lopez Manuel,Bernal Rodrigo,Minary-Jolandan Majid

Funder

National Science Foundation

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference20 articles.

1. Additive Manufacturing of Metal Structures at the Micrometer Scale;Hirt;Adv. Mater.,2017

2. Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds;Hu;Science,2010

3. Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns;Hossain Bhuiyan;ACS Appl. Mater. Interfaces,2021

4. Direct-Write Printing Copper-Nickel (Cu/Ni) Alloy with Controlled Composition from a Single Electrolyte Using Co-Electrodeposition;Wang;ACS Appl. Mater. Interfaces,2020

5. Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures;Daryadel;Nano Lett.,2018

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication of Shape‐Controlled Copper Line Arrays by Meniscus‐Confined 3D Microprinting on Insulating Substrates;Advanced Engineering Materials;2024-08-03

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