On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference10 articles.
1. Advances in lead-free electronics soldering
2. Lead-free Solders in Microelectronics
3. Reflow Soldering Processes and Troubleshooting;Lee,2001
4. Viscosity transition of ZnO-containing rosin
5. Binary Alloy Phase Diagrams;Massalski,1990
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1. Influence of Pt addition on corrosion resistance of Sn-9Zn-0.02Al-xPt solder alloys;Corrosion Science;2024-11
2. Effects of Bi Doping on Zn-Rich Phase Evolution and Physical and Chemical Properties of Sn-6.5Zn Lead-Free Solder Alloy;Journal of Materials Engineering and Performance;2024-09-09
3. The role of Sb on the microstructure and creep behaviors of Sn–6.5Zn–0.3Cu Pb-free solder alloy;Journal of Materials Science: Materials in Electronics;2024-09
4. Influence of alloying elements on microstructure, mechanical properties and corrosion behaviour of hypoeutectic Sn-6.5wt%Zn-0.5 wt%X (X = Ag, Al, Cu) lead-free solders;Journal of Materials Science: Materials in Electronics;2024-08
5. Evaluation of the microstructure, thermal, and mechanical characteristics of Sn-9Zn reinforced with Ni and ZrO2 nanoparticles via vacuum melting process;Physica Scripta;2023-09-05
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