Research on N-type silicon crystal processing by liquid-immersion wire electrical discharge machining

Author:

Qiu MingboORCID,Yao Zongxiu,Wan Rong,Wu Entao,Zhang Yimiao,Li Jingtao

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference27 articles.

1. Subsurface damage and phase transformation in laser-assisted nanometric cutting of single crystal silicon;Chen;Mater Design,2020

2. Subsurface nanocracking in monocrystalline Si (001) induced by nanoscratching;Tang;Eng. Fract. Mech.,2014

3. Advanced thermoelectric design: from materials and structures to devices;Shi;Chem. Rev.,2020

4. Adjustment of resistivity for phosphorus-doped n-type multicrystalline silicon;Iryna;Sol. Energ. Mat. Sol. C,2022

5. Electron mobility in n-type compensated czochralski silicon crystal;Yi;J. Mater. Sci. Eng.,2015

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