High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package-Reference-Cited by-同舟云学术

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High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

Published:2021-06 Issue: Volume:188 Page:109572
ISSN:0141-3910
Container-title:Polymer Degradation and Stability
language:en
Short-container-title:Polymer Degradation and Stability

Author:

Inamdar Adwait,Yang Yu-Hsiang^ORCID,Prisacaru Alexandru,Gromala Przemyslaw,Han Bongtae

Publisher

Elsevier BV

Subject

Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Condensed Matter Physics

Reference26 articles.

1. Thermal aging of molding compounds;Jansen;11th International Conference on Electronic Packaging Technology & High Density Packaging,2010

2. Aging effects of epoxy moulding compound on the long-term stability of plastic package;Nguegang,2010

3. The Effects of Silica-Based Fillers on the Properties of Epoxy Molding Compounds;Linec.;Materials,2019

4. Development trend of epoxy molding compound for encapsulating semiconductor chips;Komori,2009

5. Testing of polymeric materials;Plummer;Compr. Mater. Process.,2014

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