Author:
Al-Waaly Ahmed A.Y.,Paul Manosh C.,Dobson Phillip
Funder
The Ministry of Higher Education and Scientific Research/IRAQ
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference40 articles.
1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
2. Effect of the inlet location on the performance of parallel-channel cold-plate;Lu;IEEE Trans. Compon. Packag. Technol.,2006
3. Thermal performance and friction factor of a cylindrical microchannel heat sink cooled by Cu-water nanofluid;Azizia;Appl. Therm. Eng.,2016
4. Convective heat transfer of Cu–water nanofluid in a cylindrical microchannel heat sink;Azizi;Energy Convers. Manage.,2015
5. P.G. Hegde, K.N. Seetharamu, Effects of non-uniform base heating in multi stack microchannel heat sinks used for cooling high heat flux electronic chips and devices, in: Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International, 4–6 November 2008, Penang. http://dx.doi.org/10.1109/IEMT.2008.5507856.
Cited by
38 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献