Funder
National Natural Science Foundation of China
Chongqing Research Program of Basic Research and Frontier Technology
Innovation Team of Chongqing Universities and Colleges – Smart Micro-Nano Systems Technology and Application
Science and Technology Research Program of Chongqing Education Commission
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference41 articles.
1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
2. The effect of micro pin-fin shape on thermal and hydraulic performance of micro pin-fin heat sinks;İzci;Heat Transfer Eng.,2015
3. E. Schmidt, Die Wärmeübertragung durch Rippen, 1926.
4. A variational problem relating to cooling fins;Duffin;J. Math. Mech,1959
5. Minimum mass thin fins with internal heat generation;Wilkins;Nucl. Sci. Eng. (US),1962
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