Cooling of electronic circuits through elastocaloric solid-state technology: A numerical analysis for the development of the CHECK TEMPERATURE prototype-Reference-Cited by-同舟云学术

Cooling of electronic circuits through elastocaloric solid-state technology: A numerical analysis for the development of the CHECK TEMPERATURE prototype

Published:2023-07 Issue: Volume:230 Page:120729
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Masselli Claudia^ORCID,Cirillo Luca^ORCID,Greco Adriana^ORCID

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology,Fluid Flow and Transfer Processes,Mechanical Engineering

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