Funder
Science Fund for Creative Research Groups
National Natural Science Foundation of China
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference51 articles.
1. Cramming more components onto integrated circuits;Moore;Electronics,1965
2. The chips are down for Moore’s law;Waldrop;Nat. News.,2016
3. Nanomaterials in transistors: From high-performance to thin-film applications;Franklin;Science,2015
4. A. Bar-Cohen, J.J. Maurer, J.G. Felbinger, DARPA’s intra/interchip enhanced cooling (ICECool) program, in: Proceedings of the CS MANTECH Conference, New Orleans, Louisiana, 2013, pp. 171–174.
5. L.L. Yuan, S. Liu, M.X. Chen, X.B. Luo, Thermal analysis of high power LED array packaging with microchannel cooler, in: 7th International Conference on Electronics Packaging Technology, Shanghai, 2006, pp. 574–577. https://doi.org/10.1109/ICEPT.2006.359826.
Cited by
61 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献