An adaptive thermal management method via bionic sweat pores on electronic devices
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Published:2024-06
Issue:
Volume:247
Page:122953
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ISSN:1359-4311
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Container-title:Applied Thermal Engineering
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language:en
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Short-container-title:Applied Thermal Engineering
Author:
Yu Lihang, Jiao BinbinORCID, Ye Yuxin, Du Xiangbin, Kong Yanmei, Liu Ruiwen, Qiao Jingping, Yun Shichang, Wang Zhiqiang, Li Wei, Yan Yingzhan, Lu Dichen, Liu Ziyu, Yang Ronggui
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