1. A. Bar-Cohen, J.J. Maurer, J.G. Felbinger, DARPA’s intra/interchip enhanced cooling (ICECool) program, in: CS MANTECH Conference, May 13th-16th, 2013.
2. K.P. Bloschock, A. Bar-Cohen, Advanced Thermal Management Technologies for Defense Electronics, vol. 8405, 2012, pp. 84050I–84012.
3. Fundamental cooling limits for high power density gallium nitride electronics;Won;IEEE Trans. Components, Packaging Manuf. Technol.,2015
4. Heat transfer enhancement in micro-channel with multiple synthetic jets;Lee;Appl. Therm. Eng.,2012
5. Boiling flow characteristics in microchannels with very hydrophobic surface to super-hydrophilic surface;Liu;Int. J. Heat Mass Transfer,2011