Damage-free highly efficient polishing of single-crystal diamond wafer by plasma-assisted polishing

Author:

Yamamura K.ORCID,Emori K.,Sun R.,Ohkubo Y.ORCID,Endo K.,Yamada H.,Chayahara A.,Mokuno Y.

Funder

Adaptable and Seamless Technology Transfer Program

Target-Driven R&D

Osawa Scientific Studies Grants Foundation

Iketani Science and Technology Foundation

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference19 articles.

1. Developments of Elemental Technologies to Produce Inch-Size Single-Crystal Diamond Wafers;Yamada;Diamond and Related Materials,2011

2. Defect Analysis and Excitons Diffusion in Undoped Homoepitaxial Diamond Films after Polishing and Oxygen Plasma Etching;Volpe;Diamond and Related Materials,2009

3. Tribochemical Polishing CVD Diamond Film With FeNiCr Alloy Polishing Plate Prepared by MA-HPS Technique;Yuan;Diamond and Related Materials,2012

4. Chemical-Assisted Mechanical Polishing of Diamond Film on Wafer;Hocheng;Materials Science Forum,2006

5. Ultraviolet-Irradiated Precision Polishing of Diamond and Its Related Materials;Watanabe;Diamond and Related Materials,2013

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