Numerical study on heat transfer performance using Al2O3/water nanofluids in six circular channel heat sink for electronic chip
Author:
Publisher
Elsevier BV
Reference35 articles.
1. Unsteady heat transfer analysis of an impinging jet;Chung;J. Heat Transfer,2002
2. Turbulence statistics in the stagnation region of an axisymmetric impinging jet flow;Nishino;Int. J. Heat Fluid Flow,1996
3. Pool boiling of perfluorocarbon mixtures on silicon surfaces;Arik;Int. J. Heat Mass Transfer,2010
4. Enhanced boiling heat transfer from electronic components by use of surface microstructures;Honda;Exp. Therm. Fluid Sci.,2004
5. Prospects of confined flow boiling in thermal management of microsystems;Lin;Appl. Therm. Eng.,2002
Cited by 43 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A three-dimensional magnetohydrodynamic hybrid nanofluid flow over a convectively heated stretching surface with zero-mass flux condition;Proceedings of the Institution of Mechanical Engineers, Part N: Journal of Nanomaterials, Nanoengineering and Nanosystems;2025-04-29
2. Efficiency Enhancement of a Cone–Column Combined Microchannel Heat Sink Featuring Graphene–Water Nanofluid;Energies;2025-03-30
3. Numerical and Experimental Investigation into the Effects Combined of Hybrid Nanofluids and Micro-Finned Surfaces on Pool Boiling Heat Transfer Enhancement;International Journal of Heat and Technology;2025-02-28
4. A Review on Additive Manufacturing of Topology Optimized Microchannel Heat Sink;Heat Transfer Engineering;2025-02-03
5. Investigation of laminar flow and heat transfer performance of Gallium alloy based nanofluids in minichannel heat sink;Thermal Science and Engineering Progress;2024-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.7亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2025 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3