Parametric study of turbulent three-dimensional heat transfer of arrays of heated blocks encountered in electronic equipment
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference18 articles.
1. High heat from a small package;Oktay;Mech. Engng,1986
2. Three-dimensional heat transfer and fluid flow analysis of rectangular blocks encountered in electronic equipment;Asako;Numer. Heat Transfer,1988
3. Three-dimensional heat transfer analysis of arrays of heated square blocks;Asako;Int. J. Heat Mass Transfer,1989
4. Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment;Sparrow;Int. J. Heat Mass Transfer,1982
5. Enhanced and local heat transfer, pressure drop, and flow visualization for arrays of block-like electronic components;Sparrow;Int. J. Heat Mass Transfer,1983
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