Semi-liquefied bamboo modified urea-formaldehyde resin to synthesize composite adhesives
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference35 articles.
1. Effect of the initial F/U molar ratio in urea-formaldehyde resins synthesis and its influence on the performance of medium density fiberboard bonded with them;Dazmiri;Int J Adhesion Adhes,2019
2. Effect of spent sulfite liquor on urea–formaldehyde resin performance;Ferreira;J Appl Polym Sci,2019
3. Effects of moisture content on formaldehyde emission and mechanical properties of plywood;Aydin;Build Environ,2006
4. Effects of urea–formaldehyde resin mole ratio on the properties of particleboard;Quea;Build Environ,2007
5. Reducing formaldehyde emission of urea formaldehyde-bonded particleboard by addition of amines as formaldehyde scavenger;Ghani;Build Environ,2018
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