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2. Challenges and solutions for ultra-thin (50 μm) silicon using innovative ZoneBOND™ process;Vial;Electron Packag Technol Conf (EPTC),2012
3. Origin of the TTV of thin films obtained by temporary bonding ZoneBond® technology;Montméat;Microsyst Technol,2015
4. Innovative wafer-level encapsulation and underfill material for silicon interposer application;Ferrandon;Electron Compon Technol Conf,2013
5. Arrays of monocrystalline silicon micromirrors fabricated using cmos compatible transfer bonding;Niklaus;Jal of Micromechanical Syst,2003