Adhesive strength of flip chip packages
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference31 articles.
1. Understanding the strength of epoxy-polyimide interfaces for flip-chip packages
2. Luo SJ, Wong CP. In: Symposium on EMAP, Hong Kong, 2000. p. 243.
3. Humidity effects on adhesion strength between solder ball and epoxy underfills
4. Adhesion issued in epoxy-based chip attach adhesives
5. Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging
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