Optimization of desmear process for high adhesion of insulating film in printed circuit boards (PCBs) via Taguchi method-Reference-Cited by-同舟云学术

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Optimization of desmear process for high adhesion of insulating film in printed circuit boards (PCBs) via Taguchi method

Published:2011-09 Issue:6 Volume:31 Page:466-472
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Park Moon Soo,Cho Jae Choon,Kim Sung Hyun,Shin Dong Joo,Jung Hyung mi,Keun Lee Choon,Cho Mi-Suk,Lee Youngkwan

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference19 articles.

1. Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections;Siau;J Electrochem Soc,2004

2. PWB build-up technologies: smaller, thinner and lighter;Holden;Circuit World,1997

3. Thermal properties and water sorption behaviors of epoxy and bismaleimide composites;Seo;Macromol Res,2007

4. Poly(3,4-ethylenedioxythiophene) vapor-phase polymerization on glass substrate for enhanced surface smoothness and electrical conductivity;Truong;Macromol Res,2007

5. Amidoximation of the acrylonitrile polymer grafted on poly (tetrafluoroethylene-co-hexafluoropropylene) films and its relevance to the electroless plating of copper;Yu;Langmuir,2002

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Heterointerfacial adhesion failure mechanism of ultrahigh filler loading containing epoxy composite films for chip substrates;RSC Applied Interfaces;2024

2. Optimization of gas-flow condition for a real scale semiconductor packaging process using the Photodesmear® method;Japanese Journal of Applied Physics;2022-07-25

3. Adhesive Wet Metallization on TiO2-Coated Glass;Journal of The Electrochemical Society;2021-04-01

4. Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications;ACS Applied Electronic Materials;2019-07-03

5. Non-destructive DRIFT spectroscopy measurement of the degree of curing of industrial epoxy/silica composite buildup layers;Polymer Testing;2018-09

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