Deposition of Ti-N compounds by thermionically assisted triode reactive ion plating-Reference-Cited by-同舟云学术

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Deposition of Ti-N compounds by thermionically assisted triode reactive ion plating

Published:1980-10 Issue:3 Volume:72 Page:541-549
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Matthews A.,Teer D.G.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Grain structure of ion-plated coatings

2. The influence of bias sputter parameters on thick copper coatings deposited using a hollow cathode

3. Morphology of ion-plated titanium and aluminum films deposited at various substrate temperatures

4. Proc. Ion Plating and Allied Techniques Conf.;Matthews,1979

5. Soft Vacuum Vapour Deposition

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