Low-temperature in situ cleaning of silicon wafers with an ultra high vacuum compatible plasma source-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Low-temperature in situ cleaning of silicon wafers with an ultra high vacuum compatible plasma source

Published:1992-12 Issue:1-2 Volume:222 Page:126-131
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Ramm J.,Beck E.,Züger A.,Dommann A.,Pixley R.E.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Ideal hydrogen termination of the Si (111) surface

2. 370 °C clean for Si molecular beam epitaxy using a HF dip

3. Ultra clean processing

4. Impact of silicon surface characteristics on MOS device yield for ULSI

5. Hydrogen plasma etching of semiconductors and their oxides

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Physical vapor deposition technology for coated cutting tools: A review;Ceramics International;2020-08

2. Microwave plasma assisted process for cleaning and deposition in future semiconductor technology;IOP Conference Series: Materials Science and Engineering;2017-06

3. Hydrogen microwave plasma treatment of Si and SiO2;Surface and Coatings Technology;2016-10

4. Ar + H2 plasma etching for improved adhesion of PVD coatings on steel substrates;Vacuum;2012-02

5. Role of oxygen impurities in etching of silicon by atomic hydrogen;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2008-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP