Advances in high rate sputtering with magnetron-plasmatron processing and instrumentation-Reference-Cited by-同舟云学术

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Advances in high rate sputtering with magnetron-plasmatron processing and instrumentation

Published:1979-12 Issue:3 Volume:64 Page:455-467
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Schiller S.,Heisig U.,Goedicke K.,Schade K.,Teschner G.,Henneberger J.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference45 articles.

1. The role of plasmatron/magnetron systems in physical vapor deposition techniques

2. Thin Film Processes;Waits,1978

3. Thin Film Processes;Thornton,1978

4. Thin Film Processes;Fraser,1978

Cited by 46 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of discharge power on target poisoning and coating properties in reactive magnetron sputter deposition of TiN;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2016-07

2. Multilayer Broadband Antireflective Coatings for More Efficient Thin Film CdTe Solar Cells;IEEE Journal of Photovoltaics;2014-01

3. Sputtering and Thin Film Deposition;Sputtering Materials for VLSI and Thin Film Devices;2014

4. Influencing the hysteresis during reactive magnetron sputtering by gas separation;Surface and Coatings Technology;2013-11

5. Metallizing;Encyclopedia of Polymer Science and Technology;2011-03-15

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