Effect of sawing induced micro-crack orientations on fracture properties of silicon wafers
Author:
Funder
The Research Council of Norway
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference26 articles.
1. Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers;Hardin;Mater Manuf Process,2004
2. Mechanical strength of silicon wafers cut by loose abrasive slurry and fixed abrasive diamond wire sawing;Wu;Adv Engng Mater,2012
3. Analysis of stresses and breakage of crystalline silicon wafers during handling and transport;Brun;Sol Energy Mater Sol C,2009
4. Strength and sharp contact fracture of silicon;Cook;J Mater Sci,2006
5. Crystalline silicon: manufacture and properties;Ferrazza,2012
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A critical review on the fracture of ultra-thin photovoltaics silicon wafers;Solar Energy Materials and Solar Cells;2024-08
2. Transverse forced vibration of a diamond wire under support excitations;International Journal of Mechanical Sciences;2023-01
3. Breakage Ratio of Silicon Wafer during Fixed Diamond Wire Sawing;Micromachines;2022-11-02
4. A study on the etching characteristics of atmospheric pressure plasma for single-crystal silicon wafer;Vacuum;2021-08
5. Weibull strength size effect of diamond wire sawn photovoltaic silicon wafers;Journal of the European Ceramic Society;2020-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3