Thermal conductivity and thermo-physical properties of nanodiamond-attached exfoliated hexagonal boron nitride/epoxy nanocomposites for microelectronics-Reference-Cited by-同舟云学术

Thermal conductivity and thermo-physical properties of nanodiamond-attached exfoliated hexagonal boron nitride/epoxy nanocomposites for microelectronics

Published:2017-10 Issue: Volume:101 Page:227-236
ISSN:1359-835X
Container-title:Composites Part A: Applied Science and Manufacturing
language:en
Short-container-title:Composites Part A: Applied Science and Manufacturing

Author:

Zhang Yinhang,Choi Jang Rak,Park Soo-Jin^ORCID

Publisher

Elsevier BV

Subject

Mechanics of Materials,Ceramics and Composites

Reference48 articles.

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3. BN-MWCNT/PPS core-shell structured composite for high thermal conductivity with electrical insulating via particle coating;Kim;Polymer,2016

4. Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers;Choi;Compos Part B Eng,2013

5. Enhanced thermal conductivity of polymer matrix composite via high solids loading of aluminum nitride in epoxy resin;Lee;J Am Ceram Soc,2008

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