Enhancing thermal mechanical properties of polymer composites with hollow porous fillers
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Published:2024-04
Issue:
Volume:179
Page:108048
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ISSN:1359-835X
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Container-title:Composites Part A: Applied Science and Manufacturing
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language:en
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Short-container-title:Composites Part A: Applied Science and Manufacturing
Author:
Yi Haokun,
Mei Shuxing,
Shen HemingORCID,
Zhang Rong,
Li Zhuo
Reference57 articles.
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5. Underfill technology for fine pitch flip chip applications;Zhu,2016
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