1. Integrated circuit packaging review with an emphasis on 3D packaging;Lancaster;Integrat VLSI J,2017
2. Comparison of IMC growth in flip-chip assemblies with 100- and 200-μm-pitch SAC305 solder joints;Tian;Electron Compon Technol Conf,2013
3. Board-level solder joint reliability analysis of thermally enhanced BGAs and LGAs;Tee;IEEE Trans Adv Packag,2006
4. Size effects in small scaled lead-free solder joints;Zimprich;J Mater Sci Mater Electron,2008
5. Experimental damage analysis and numerical reliability modeling of lead-free ball-grid-array second level interconnects;Pustan,2010