Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference29 articles.
1. Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn–Ag–Cu solder interconnects: surface finish effects;Lee;J Electron Mater,2010
2. Effects of minor Ni doping on microstructural variations and interfacial reactions in Cu/Sn–3.0Ag–0.5Cu–xNi/Au/Ni sandwich structures;Yu;J Electron Mater,2010
3. Effects of joining sequence on the interfacial reactions and substrate dissolution behaviors in Ni/solder/Cu joints;Liu;J Electron Mater,2011
4. Cross-interaction between Ni and Cu across Sn layers with different thickness;Chang;J Electron Mater,2007
5. Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures;Wang;J Electron Mater,2006
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