Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference49 articles.
1. Properties of lead-free solder alloys with rare earth element additions
2. Creep deformation characteristics of tin and tin-based electronic solder alloys
3. A modified constitutive model for creep of Sn–3.5Ag–0.7Cu solder joints
4. Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures
5. Indentation creep study of lead-free Sn–5%Sb solder alloy
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1. Electrical Resistivity of Lead-Free Solders Reinforced by Carbon Nanospheres;International Journal of Thermophysics;2024-02-06
2. Effect of Ni-deposited carbon nanotubes on morphology and shear strength of lead-free solder joints;Journal of Physical Studies;2024
3. Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler;Journal of Electronic Materials;2023-12-21
4. Study on Ni-GNSs enhanced Sn2.5Ag0.7Cu0.1RE/Cu solder joints β-Sn grain orientation and interfacial IMC growth kinetics under constant temperature thermomigration;Materials Characterization;2023-11
5. Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites;Applied Nanoscience;2023-07-07
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