Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference40 articles.
1. Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In;EL-Daly;J. Alloys Compd.,2011
2. Mechanical property and fracture characterizations of 96.5Sn-3.5Ag-0.5Cu solder joints;Chang;J. Alloys Compd.,2010
3. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid St. M.,2001
4. Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints;Che;J. Alloys Compd.,2012
5. On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints;Yazzie;Scr. Mater,2012
Cited by 42 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations;Intermetallics;2024-09
2. Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints;Materials;2024-04-25
3. Alteration of Cu3Sn growth and retention of multi-orientation Cu6Sn5 during thermal aging in Cu-xNi-yZn/Sn3.5Ag/Cu transient liquid-phase bonding;Materials Characterization;2024-01
4. A Comparative Investigation of Machine Learning Algorithms for Pore-Influenced Fatigue Life Prediction of Additively Manufactured Inconel 718 Based on a Small Dataset;Materials;2023-10-09
5. Atomistic simulation of mechanical behavior of Cu/Cu3Sn solder interface with Kirkendall void under shear and tensile deformation;Applied Physics A;2023-03-13
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3