Improvement of microstructure and interface structure of eutectic Sn–0.7Cu solder with small amount of Zn addition-Reference-Cited by-同舟云学术

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Improvement of microstructure and interface structure of eutectic Sn–0.7Cu solder with small amount of Zn addition

Published:2005-09 Issue:6 Volume:53 Page:699-702
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

WANG F,MA X,QIAN Y

Publisher

Elsevier BV

Cited by 104 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of Annealing Treatment on the Microstructure and Micromechanical Properties of Pb-Containing and Pb-Free Solder Alloys;Materials;2025-06-02

2. Ni/Zn additions in Sn–Cu solder: enhanced elasticity and reliability via intermetallic strengthening;Journal of Materials Science;2025-06

3. The combined effect of reflow soldering time and Bi doping on the interfacial behavior and shear properties of Sn-0.7Cu-0.8Zn/Cu solders joint;Journal of Materials Research and Technology;2025-05

4. Optimizing the performance of Sn–Cu alloys via microalloying with Ni and Zn: a study on microstructure, thermal, and mechanical properties;Journal of Materials Science: Materials in Electronics;2025-01

5. Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification;Journal of Electronic Materials;2024-04-10

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