Amorphous Ta-Si-N diffusion barriers in Si/Al and Si/Cu metallizations-Reference-Cited by-同舟云学术

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Amorphous Ta-Si-N diffusion barriers in Si/Al and Si/Cu metallizations

Published:1991-11 Issue: Volume:53 Page:373-376
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Kolawa E.,Pokela P.J.,Reid J.S.,Chen J.S.,Nicolet M.-A.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference10 articles.

1. Diffusion barriers in thin films

2. General aspects of barrier layers for very-large-scale integration applications I: Concepts

3. General aspects of barrier layers for very-large-scale integration applications II: Practice

4. Barrier layers: Principles and applications in microelectronics

5. Diffusion barriers in semiconductor contact metallizations;Kattelus,1988

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