Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe-Reference-Cited by-同舟云学术

Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe

Published:2014-11 Issue: Volume:130 Page:303-308
ISSN:0927-0248
Container-title:Solar Energy Materials and Solar Cells
language:en
Short-container-title:Solar Energy Materials and Solar Cells

Author:

Budiman A.S.,Illya G.,Handara V.,Caldwell W.A.,Bonelli C.,Kunz M.,Tamura N.,Verstraeten D.

Funder

SunPower Corporation

Singapore University of Technology and Design (SUTD)

Surya University

Director, Office of Science, Office of Basic Energy Sciences, Materials Sciences Division of the U.S.Department of Energy

NSF

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference18 articles.

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3. J. Wendt, M. Träger, M. Mette, A. Pfennig, B. Jaeckel, The link between mechanical stress induced by soldering and micro damages in silicon solar cells, in: Proceedings of EUPVSEC, 2009, pp. 3420–3423.

4. A. Gabor, M. Ralli, S. Montminy, L. Alegria, C. Bordonaro, J. Woods, L. Felton, Soldering induced damage to thin Si solar cells and detection of cracked cells in modules, in: Proceedings of EUPVSEC, 2006.

5. S. Nieland, M. Baehr, A. Boettger, A. Ostmann, H. Reichl, Advantages of microelectronic packaging for low temperature lead free soldering of thin solar cells, in: Proceedings of EUPVSEC, 2007.

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