EMC characterization and process study for electronics packaging-Reference-Cited by-同舟云学术

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EMC characterization and process study for electronics packaging

Published:2004-09 Issue: Volume:462-463 Page:454-458
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Liu S.L.,Chen G.,Yong M.S.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Polymer Materials for Electronics Packaging and Interconnection;Lupinski,1989

2. Plastic Packaging of Microelectronic Devices;Manzione,1990

3. Microelectronics Packaging Handbook;Tummala,1989

4. Electronic Packaging Materials and Their Properties;Pecht,1999

5. Plastic-Encapsulated Microelectronics,1995

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