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Investigation of Al-induced electroless Sn film deposition on Cu substrate

  • Published:2019-12 Issue: Volume:692 Page:137578
  • ISSN:0040-6090
  • Container-title:Thin Solid Films
  • language:en
  • Short-container-title:Thin Solid Films

Author:

Ghosh SwatilekhaORCID

Funder

Department of Science and Technology, Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference32 articles.

1. Nickel plating on steel by chemical reduction;Brenner;J. Res. Natl. Bur. Stand.,1946

2. Chemical (Electroless)Nickel-Plating;Gawrilov,1979

3. Electroless Nickel Plating;Riedel,1991

4. Electroless (autocatalytic) plating;Henry;Met. Finish,2002

5. A. Molenaar, Bath for Electroless Depositing Tin on Substrates, United States Patent No. 4,269,625,Netherlands, May 26, 1981.

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