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The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects

  • Published:2007-02 Issue:6 Volume:515 Page:3246-3252
  • ISSN:0040-6090
  • Container-title:Thin Solid Films
  • language:en
  • Short-container-title:Thin Solid Films

Author:

Ang D.,Wong C.C.,Ramanujan R.V.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Stress-Induced Phenomena in Metallization, First International Workshop;Totta,1991

2. Stress analysis of encapsulated fine‐line aluminum interconnect

3. Stress in metal lines under passivation; comparison of experiment with finite element calculations

4. Thermal stresses in aluminum lines bounded to substrates

5. Stress-Induced Phenomena in Metallization, Third International Workshop;Burges,1995

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1. Cracking in semiconductor devices–effect of plasticity under triaxial constraint;Journal of the Mechanics and Physics of Solids;2024-09

2. Strategy against electromigration-induced stress by passivation thickness design;Thin Solid Films;2023-11

3. Low frequency tantalum electromechanical systems for biomimetical applications;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2011-11

4. Finite element modeling of hydrostatic stress distribution in copper dual-damascene interconnects;Journal of Shanghai Jiaotong University (Science);2011-06

5. Finite element simulation of hydrostatic stress in copper interconnects;Journal of Semiconductors;2011-05
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