Investigation on the machining mechanism of silicon modified by Au ion irradiation in elliptical vibration diamond cutting-Reference-Cited by-同舟云学术

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Investigation on the machining mechanism of silicon modified by Au ion irradiation in elliptical vibration diamond cutting

Published:2024-12 Issue: Volume:91 Page:27-35
ISSN:0141-6359
Container-title:Precision Engineering
language:en
Short-container-title:Precision Engineering

Author:

Fu Yufan^ORCID,Shen Zhenfeng,Mo Honglei,Zhang Jianguo,Chen Xiao,Xiao Junfeng,Xu Jianfeng

Publisher

Elsevier BV

Reference27 articles.

1. Handbook of silicon based MEMS materials and technologies,2020

2. Si and SiGe millimeter-wave integrated circuits;Russer;IEEE Trans Microw Theor Tech,1998

3. A comparative study on cost and life-cycle analysis for 100 MW very large-scale PV (VLS-PV) systems in deserts using m-Si, a-Si, CdTe, and CIS modules;Ito;Prog Photovoltaics Res Appl,2008

4. Infrared properties of high-purity silicon;Wollack;Opt Lett,2020

5. High-resolution patterning of graphene by screen printing with a silicon stencil for highly flexible printed electronics;Hyun;Adv Mater,2015

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