Compensating corner undercutting in anisotropic etching of (100) silicon
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference8 articles.
1. Anisotropic etching of silicon;Lee;J. Appl. Phys.,1969
2. Optimization of the hydrazine-water solution for anisotropic etching;Declercq;J. Electrochem. Soc.,1975
3. Anisotropic etching of silicon;Bean,1978
4. Corner undercutting in anisotropically etched isolation contours;Abu-Zeid;J. Electrochem. Soc.,1984
5. A studty on deep etching of silicon using ethylene-diamine-pyrocatechol-water;Wu;Sensors and Actuators,1986
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