Study on curing degree of emulsified asphalt chip seal based on the comprehensive electrical properties index

Author:

Zeng QingweiORCID,Zhang YangORCID,Yang ShunxinORCID,Xiao FengORCID,Luan Dongxing,Cui Qixuan

Funder

National Key Research and Development Program of China

Southeast University

Publisher

Elsevier BV

Reference32 articles.

1. Investigation of adhesion and interface bond strength for pavements underlying chip-seal: effect of asphalt-aggregate combinations and freeze-thaw cycles on chip-seal;You;Constr. Build. Mater.,2019

2. Chip seal and fiber seal, Beihang University, Beijing;Li;China,2021

3. A procedure for characterizing the curing process of cold recycled bitumen emulsion mixtures;Graziani;Constr. Build. Mater.,2018

4. ASTM D7000 (2011). Standard test method for sweep test of bituminous emulsion surface treatment samples. Conshohocken, PA: American Society for Testing and Materials.

5. Sensitivity of ASTM D7000 sweep test to emulsion application rate and aggregate gradation;Johannes;Transp. Res. Rec.,2011

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