1. Thermal challenges in next generation electronic systems- summary of panel presentations and discussions, Institute of Electrical and Electronic Engineers;Garimella;Trans. Component Packag. Technol.,2002
2. Microelectronic Packaging Handbook;Tummala,1989
3. P. Mithal, Design of experimental based evaluation of thermal performance of a chip electronic assembly, in American Society of Mechanical Engineers, Sensing Modeling and Simulation in Emerging Electronic Packaging Proceedings, New York, vol. 18, 1996, pp. 109–115.
4. Electronic Materials and Processes Handbook;Charles,2004
5. Thermal performance challenges from silicon to system;Viswanath;Intel Technol. J.,2000