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Parametric study on thermal performance of microchannel heat sinks with internal vertical Y-shaped bifurcations

  • Published:2015-11 Issue: Volume:90 Page:948-958
  • ISSN:0017-9310
  • Container-title:International Journal of Heat and Mass Transfer
  • language:en
  • Short-container-title:International Journal of Heat and Mass Transfer

Author:

Xie Gongnan,Shen Han,Wang Chi-Chuan

Funder

National Natural Science Foundation of China

Specialized Research Fund

Fundamental Research Funds

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference36 articles.

1. Emerging directions for packaging technologies;Mahajan;Intel Technol. J.,2002

2. Nano and micro technology-based next-generation package-level cooling solutions;Prasher;Intel Technol. J.,2005

3. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981

4. Experimental investigation of thermoelectric power generation versus coolant pumping power in a microchannel heat sink;Rezania;Int. Commun. Heat Mass Transfer,2012

5. Numerical study of heat transfer performance of single-phase heat sinks with micro pin-fin structures;Shafeie;Appl. Therm. Eng.,2013

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