Funder
Natural Sciences and Engineering Research Council of Canada
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference37 articles.
1. J. Lee, Convection performance of nanofluids for electronics cooling (PhD thesis), Stanford University, 2009.
2. Calculation of surface heat transfer coefficient for electronic module packages;Buller;ASME Winter Annu. Meet.,1981
3. Heat transfer and pressure drop characteristics of array of rectangular modules in electronic equipment;Sparrow;Int. J. Heat Mass Transf.,1982
4. Enhanced local heat transfer, pressure drop, flow visualization for arrays of block-like electronic components;Sparrow;Int. J. Heat Mass Transf.,1983
5. Convective heat transfer response to height differences in an array of block-like electronic components;Sparrow;Int. J. Heat Mass Transf.,1984
Cited by
36 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献