IC-Compatible Polysilicon Surface Micromachining

Abstract

▪ Abstract  Polysilicon surface micromachining is advancing significantly and many new applications are moving beyond the prototyping phase. Recent technical successes are leading to excitement concerning various uses of devices in optical, wireless, sensor, and many other areas. Incorporation of state-of-the-art integrated circuit (IC) fabrication methods, such as planarization by chemical mechanical polishing (CMP), has enabled extension to a five-level technology. This has opened significant design space, especially for microactuator applications. Recent advancement of in situ microdiagnostics for materials and surface properties has enhanced our understanding of device reliability and performance and will allow devices to operate near well-known materials limits. New IC-compatible materials will further enhance the capabilities of microsystems in terms of performance, reliability, and operation in harsh environments.