ITRW: Formulating a Roadmap for WBG and UWBG Materials and Devices-Reference-Cited by-同舟云学术

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ITRW: Formulating a Roadmap for WBG and UWBG Materials and Devices

Published:2019-06-01 Issue: Volume: Page:
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Author:

Veliadis Victor¹,Kaplar Robert²,Zhang Jon³,Khalil Sameh⁴,Flicker Jack²,Neely Jason²,Binder Andrew²,Atcitty Stanley²,Moens Peter⁵,Bakowski Mietek⁶,Hollis Mark⁷

Affiliation:

1. North Carolina State Univ., Raleigh, NC (United States)

2. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

3. Alpha & Omega Semiconductor, Sunnyvale, CA (United States)

4. Infineon Technologies, Los Angeles, CA (United States)

5. ON Semiconductor, Oudenaarde (Belgium)

6. Acreo Swedish ICT AB, Stockholm (Sweden)

7. Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)

Publisher

Office of Scientific and Technical Information (OSTI)

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In-Chip Microfluidic Cooling Integrated on GaN Power IC Reaching High Power Density of 78 kW/l;IEEE Transactions on Power Electronics;2024-08

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