Neuro-inspired electronic skin for robots

Author:

Liu Fengyuan1ORCID,Deswal Sweety1ORCID,Christou Adamos1ORCID,Sandamirskaya Yulia2ORCID,Kaboli Mohsen34ORCID,Dahiya Ravinder1ORCID

Affiliation:

1. Bendable Electronics and Sensing Technologies (BEST) Group, James Watt School of Engineering, University of Glasgow, G12 8QQ Glasgow, UK.

2. Neuromorphic Computing Intel Labs, Munich, Germany.

3. Department of Research, New Technologies, Innovation, BMW Group, Parkring 19, 85748 Garching bei Munchen, Germany.

4. Cognitive Robotics and Tactile Intelligence Group, Donders Institute for Brain, Cognition, and Behaviour, Radboud University, Nijmegen, Netherlands.

Abstract

Touch is a complex sensing modality owing to large number of receptors (mechano, thermal, pain) nonuniformly embedded in the soft skin all over the body. These receptors can gather and encode the large tactile data, allowing us to feel and perceive the real world. This efficient somatosensation far outperforms the touch-sensing capability of most of the state-of-the-art robots today and suggests the need for neural-like hardware for electronic skin (e-skin). This could be attained through either innovative schemes for developing distributed electronics or repurposing the neuromorphic circuits developed for other sensory modalities such as vision and audio. This Review highlights the hardware implementations of various computational building blocks for e-skin and the ways they can be integrated to potentially realize human skin–like or peripheral nervous system–like functionalities. The neural-like sensing and data processing are discussed along with various algorithms and hardware architectures. The integration of ultrathin neuromorphic chips for local computation and the printed electronics on soft substrate used for the development of e-skin over large areas are expected to advance robotic interaction as well as open new avenues for research in medical instrumentation, wearables, electronics, and neuroprosthetics.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Artificial Intelligence,Control and Optimization,Computer Science Applications,Mechanical Engineering

Cited by 126 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3