Robust and sensitive conductive nanocomposite hydrogel with bridge cross-linking–dominated hierarchical structural design

Author:

Li Tian1ORCID,Qi Haobo1ORCID,Zhao Yijing1ORCID,Kumar Punit2ORCID,Zhao Cancan3ORCID,Li Zhenming3,Dong Xinyu1ORCID,Guo Xiao1ORCID,Zhao Miao1ORCID,Li Xinwei1ORCID,Wang Xudong3,Ritchie Robert O.2ORCID,Zhai Wei1ORCID

Affiliation:

1. Department of Mechanical Engineering, National University of Singapore, Singapore 117575, Singapore.

2. Department of Materials Science & Engineering, University of California, Berkeley, Berkeley, CA 94720, USA.

3. Department of Oral and Cranio-Maxillofacial Surgery, Shanghai Ninth People’s Hospital, College of Stomatology, Shanghai Jiao Tong University School of Medicine; National Clinical Research Center for Oral Diseases; Shanghai Key Laboratory of Stomatology & Shanghai Research Institute of Stomatology, Shanghai 200011, China.

Abstract

Conductive hydrogels have a remarkable potential for applications in soft electronics and robotics, owing to their noteworthy attributes, including electrical conductivity, stretchability, biocompatibility, etc. However, the limited strength and toughness of these hydrogels have traditionally impeded their practical implementation. Inspired by the hierarchical architecture of high-performance biological composites found in nature, we successfully fabricate a robust and sensitive conductive nanocomposite hydrogel through self-assembly–induced bridge cross-linking of MgB 2 nanosheets and polyvinyl alcohol hydrogels. By combining the hierarchical lamellar microstructure with robust molecular B─O─C covalent bonds, the resulting conductive hydrogel exhibits an exceptional strength and toughness. Moreover, the hydrogel demonstrates exceptional sensitivity (response/relaxation time, 20 milliseconds; detection lower limit, ~1 Pascal) under external deformation. Such characteristics enable the conductive hydrogel to exhibit superior performance in soft sensing applications. This study introduces a high-performance conductive hydrogel and opens up exciting possibilities for the development of soft electronics.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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