Direct gold bonding for flexible integrated electronics-Reference-Cited by-同舟云学术

Direct gold bonding for flexible integrated electronics

Published:2021-12-24 Issue:52 Volume:7 Page:
ISSN:2375-2548
Container-title:Science Advances
language:en
Short-container-title:Sci. Adv.

Author:

Takakuwa Masahito¹²^ORCID,Fukuda Kenjiro²³^ORCID,Yokota Tomoyuki⁴^ORCID,Inoue Daishi²,Hashizume Daisuke²^ORCID,Umezu Shinjiro¹^ORCID,Someya Takao²³⁴^ORCID

Affiliation:

1. Department of Modern Mechanical Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan.

2. Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.

3. Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.

4. Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan.

Abstract

Water vapor plasma treatment enables direct gold bonding on flexible polymer films in air at ambient temperatures.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference30 articles.

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5. Nanograting Structured Ultrathin Substrate for Ultraflexible Organic Photovoltaics

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