Converting Ceria Polyhedral Nanoparticles into Single-Crystal Nanospheres

Author:

Feng Xiangdong12345,Sayle Dean C.12345,Wang Zhong Lin12345,Paras M. Sharon12345,Santora Brian12345,Sutorik Anthony C.12345,Sayle Thi X. T.12345,Yang Yi12345,Ding Yong12345,Wang Xudong12345,Her Yie-Shein12345

Affiliation:

1. Ferro Corporation, 7500 East Pleasant Vally Road, Independence, OH 44131, USA.

2. Cranfield University, Defense Academy of the United Kingdom, Shrivenham, Swindon SN6 8LA, UK.

3. School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332–0245, USA.

4. Department of Advanced Materials and Nanotechnology, College of Engineering, Peking University, 100871 Beijing, China.

5. National Center for Nanoscience and Technology, Beijing 100080, China.

Abstract

Ceria nanoparticles are one of the key abrasive materials for chemical-mechanical planarization of advanced integrated circuits. However, ceria nanoparticles synthesized by existing techniques are irregularly faceted, and they scratch the silicon wafers and increase defect concentrations. We developed an approach for large-scale synthesis of single-crystal ceria nanospheres that can reduce the polishing defects by 80% and increase the silica removal rate by 50%, facilitating precise and reliable mass-manufacturing of chips for nanoelectronics. We doped the ceria system with titanium, using flame temperatures that facilitate crystallization of the ceria yet retain the titania in a molten state. In conjunction with molecular dynamics simulation, we show that under these conditions, the inner ceria core evolves in a single-crystal spherical shape without faceting, because throughout the crystallization it is completely encapsulated by a molten 1- to 2-nanometer shell of titania that, in liquid state, minimizes the surface energy. The principle demonstrated here could be applied to other oxide systems.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference28 articles.

1. R. K. Singh, R. Bajaj, Mater. Res. Soc. Bull.27, 743 (2002).

2. CMP is a process that is used in the semiconductor industry to isolate and connect individual transistors on a chip. The CMP process has been the fastest growing semiconductor operation in the past decade and its future growth is expected to be equally explosive because of the introduction of copper-based interconnects in advanced microprocessors and other applications of CMP for next-generation nanoscale devices. The CMP slurries typically contain particle-based abrasives which constituted nearly 60% of the total $1 billion worldwide market for nanopowders in 2005.

3. H. Chen, H. Chang, Ceram. Int.31, 795 (2005).

4. F. Zhang et al., Appl. Phys. Lett.80, 127 (2002).

5. F. Bondioli et al., J. Mater. Chem.15, 1061 (2005).

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3