Imaging of nonlocal hot-electron energy dissipation via shot noise-Reference-Cited by-同舟云学术

Imaging of nonlocal hot-electron energy dissipation via shot noise

Published:2018-05-18 Issue:6390 Volume:360 Page:775-778
ISSN:0036-8075
Container-title:Science
language:en
Short-container-title:Science

Author:

Weng Qianchun¹²^ORCID,Komiyama Susumu¹³,Yang Le⁴^ORCID,An Zhenghua⁴⁵^ORCID,Chen Pingping¹,Biehs Svend-Age⁶^ORCID,Kajihara Yusuke²^ORCID,Lu Wei¹^ORCID

Affiliation:

1. National Laboratory for Infrared Physics, Shanghai Institute of Technical Physics, The Chinese Academy of Sciences, Shanghai 200083, PR China.

2. Institute of Industrial Science, The University of Tokyo, Komaba 4-6-1, Meguro-ku, Tokyo, 153-8505, Japan.

3. Department of Basic Science, The University of Tokyo, Komaba 3-8-1, Meguro-ku, Tokyo, 153-8902, Japan.

4. State Key Laboratory of Surface Physics, Institute for Nanoelectronic Devices and Quantum Computing, and Key Laboratory of Micro and Nano Photonics Structures (Ministry of Education), Department of Physics, Fudan University, Shanghai 200433, PR China.

5. Collaborative Innovation Center of Advanced Microstructures, Nanjing 210093, PR China.

6. Institut für Physik, Carl von Ossietzky Universität, D-26111 Oldenburg, Germany.

Abstract

Taking the temperature of hot electrons As electronic chips become smaller, efficient heat dissipation becomes a greater challenge. Electrons in such devices quickly accelerate over small distances, becoming “hot”—that is, out of equilibrium with the rest of the system. Weng et al. designed a thermometry probe that measures the effective temperature of hot electrons with a spatial resolution of about 50 nanometers. The method is based on the optical measurement of current noise and provides a glimpse into where heat is naturally dissipated in a working device. Science , this issue p. 775

Funder

National Natural Science Foundation of China

National Key Research Program of China

Shanghai Science and Technology Committee

Chinese Academy of Sciences Visiting Professorships for Senior International Scientists

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference56 articles.

1. The chips are down for Moore’s law

2. Colloquium: Heat flow and thermoelectricity in atomic and molecular junctions