Engineering a Copper (II) Functionalized Silk Fibroin Film for Cellular Behavior Modulation

Abstract

Abstract Engineering silk fibroin-based biomaterials with tunable functional properties is pivotal for the next generation of tissue engineering and regenerative medicine. We introduce a novel surface engineering technique that harnesses the unique chemistry of silk fibroin to fabricate films with controlled release of copper (II) ions (Cu2+), known to enhance wound healing processes. By employing a facile film-forming solution and subsequent modification with polydopamine (PDA), we developed silk fibroin (SF) films coated withCuNPs, termed SF-PDA-CuNPs (SPC). This innovative methodology is not only straightforward and reproducible but also effective in functionalizing silk fibroin. Our engineered SPC films demonstrate a slow and sustained release of bioactive Cu2+ for a marked acceleration in wound closure of living mammalian cells. These findings underscore the potential of Cu2+-loaded SF films as a novel strategy for enhancing wound repair, opening new avenues for the application of silk fibroin in advanced wound care solutions.