Study on the Design of Thermal Vibration Integrated Reliability Enhancement test Profile based on Multi-stress Failure Excitation Simulation

Abstract

Abstract The current reliability enhanced test profiles are inefficient and costly, an integrated temperature and vibration reliability enhancement test profile design method based on multi-stress failure excitation simulation (MSS-RET) for typical ballistic devices is presented in this paper. First, the fault logic analysis is conducted by combining the product fault tree and product structural characteristics, and establishment of a integrated test profile design framework, to improve the determination of profile elements of the guidelines. using multi-stress finite element deterministic analysis joint failure physical model of the failure prediction method, obtain a vibration termination stress valuation, starting stress, and other profile elements, achieved the optimization of the test accuracy; Combined with relevant standards, clarify the temperature stabilization time. Through the principle of thermal stress generation, combined with finite element simulation data analysis, specify the vibration excitation loading time, optimize fault excitation intensity, improve the low efficiency and high cost of the reinforcement test. The MSS-RET is validated by taking the design of a comprehensive temperature and vibration test profile of a fuze detection module as an example, the results shows that the obtained test profile can reduce the test error by up to 44% compared with the traditional method.